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Prabha Materials Science Letters

eISSN: 2583-5114 . Open Access


Insight into Mechanisms of Electronic Sputtering in Gold-Silica Nanocomposite: Effect of Size of Au Nanoparticle

Insight into Mechanisms of Electronic Sputtering in Gold-Silica Nanocomposite: Effect of Size of Au Nanoparticle

Vinay Kumar Srivastava
Department of Physics, Deen Dayal Upadhyaya Gorakhpur University Gorakhpur, Gorakhpur, 273009, Uttar Pradesh, India.

Shivani Chaudhary
Department of Physics, Deen Dayal Upadhyaya Gorakhpur University Gorakhpur, Gorakhpur, 273009, Uttar Pradesh, India.

Udai Bhan Singh
Department of Physics, Deen Dayal Upadhyaya Gorakhpur University Gorakhpur, Gorakhpur, 273009, Uttar Pradesh, India.

DOI https://doi.org/10.33889/PMSL.2025.4.2.021

Received on July 28, 2025
  ;
Accepted on August 18, 2025

Abstract

This research examines the electronic sputtering characteristics of Au:SiO₂ nanocomposite thin films, focusing on size dependence, when subjected to 100 MeV Ag ion irradiation. Au:SiO₂ films were deposited on quartz substrates through atom beam sputtering, subsequently undergoing controlled annealing at 850°C in an Ar atmosphere to optimize the nanoparticle size. The progression of nanoparticle dimensions and their optical characteristics was observed via UV–Visible spectroscopy, validating an increase in size following the annealing process. Post-irradiation analysis employing Rutherford Backscattering Spectrometry (RBS) demonstrated a distinct inverse correlation between the size of nanoparticles and the sputtering yield. The results show that as nanoparticle size increases, the electronic sputtering yield decreases, highlighting the crucial role that nanostructure dimensions play in swift heavy ion–matter interactions.

Keywords- Sputtering, Nanocomposite, Surface plasmon resonance, RBS, Thermal spike

Citation

Srivastava, V. K. Chaudhary, S., & Singh, U. B (2025). Insight into Mechanisms of Electronic Sputtering in Gold-Silica Nanocomposite: Effect of Size of Au Nanoparticle. Prabha Materials Science Letters, 4(2), 259-266. https://doi.org/10.33889/PMSL.2025.4.2.021.